| BioTech Services Division Our BioTech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of micro fluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services for prototype or preproduction runs. They are usually involved in the area of Life Sciences and are designing cutting edge BioTech devices including micro arrays, microchips, MEMS micro fluidic devices and Lab chips. |
Services we provide 
We create small holes in hard brittle wafers using a micro abrasive drilling
process.
We provide singulation of plates and slides using standard semiconductor dicing
processes.
We also provide straight line channels in plates and slides.Air abrasion drilling The drilling process uses an air abrasion drilling technique that creates a conical shaped hole. The process utilizes very small abrasive particles accelerated with high pressure air through a sapphire nozzle. The placement of the nozzle is computer controlled by precision X/Y tables. The conical shaped hole is wider at the entry point of the blast stream. The diameter of the entry side of the hole is approximately equal to the diameter of the exit plus the thickness of the material. (i.e.. If an exit hole of 1 mm is required in a 1 mm thick wafer then the entry hole diameter will be 2 mm).
Characteristics of the process Advantages over laser drilling |
